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분야 | TC 47 : Semiconductor devices |
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적용범위 | IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”. |
국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
페이지수 | 17 |
Edition | 3.0 |
No. | 표준번호 | 표준명 | 발행일 | 상태 |
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1 | IEC 60749-5:2023 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-12-19 | 표준 |
2 | IEC 60749-5:2023 RLV | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2023-12-19 | 표준 |
3 | IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2017-04-10 | 구판 |
4 | IEC 60749-5:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 2003-01-17 | 구판 |
IEC 60749-2:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure 상세보기
IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing 상세보기
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) 상세보기
IEC 60749-25:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling 상세보기
IEC 60747-15:2010 - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices 상세보기
IEC 60749-34:2010 - Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling 상세보기
IEC 60068-2-27:2008 - Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock 상세보기
IEC 60068-2-6:2007 - Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) 상세보기
IEC TS 63134:2020 - Active assisted living (AAL) use cases 상세보기
IEC 60034-5:2020 RLV - Rotating electrical machines - Part 5: Degrees of protection provided by the integral design of rotating electrical machines (IP code) - Classification 상세보기
KS B ISO TS 25740-1 - 에스컬레이터 및 무빙워크에 대한 안전요건 — 제1부: 세계공통 필수 안전요건(GESRs) 상세보기
KS B ISO TS 8100-21 - 승객 및 화물 운송용 엘리베이터 —제21부: 세계공통 필수안전요건(GESRs)을 충족하는 세계공통 안전 파라미터(GSPs) 상세보기
KS C IEC TS 62872 - 산업 시설과 스마트 그리드 사이의 산업 공정 측정, 제어 및 자동화 시스템 인터페이스 상세보기