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Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
| 분야 | TC 47 : Semiconductor devices |
|---|---|
| 적용범위 | Covers the testing of low air pressure on semiconductor devices. The test is intended primarily to determine the ability of component parts and materials to avoid voltage breakdown failures due to the reduced dielectric strength of air and other insulating materials at reduced pressures is only applicable to devices where the operating voltage exceeds 1 000 V. This test is applicable to all semiconductor devices provided they are in cavity type packages. The test is intended for military and space-related applications only. The contents of the corrigendum of August 2003 have been included in this copy. |
| 국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
| 페이지수 | 11 |
| Edition | 1.0 |
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 60749-2:2002/COR1:2003 | Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure | 2003-08-12 | 표준 |
| 2 | IEC 60749-2:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure | 2002-04-12 | 표준 |
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