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Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
| 분야 | TC 47 : Semiconductor devices |
|---|---|
| 적용범위 | IEC 63287-1:2021 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications. NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified. NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project. This first edition of IEC 63287-1 cancels and replaces the first edition of IEC 60749-43 published in 2017. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: the document has been renamed and renumbered to distinguish it from the IEC 60749 (all parts); a new section concerning the concept of "family" has been added with appropriate renumbering of the existing text. |
| 국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
| 페이지수 | 86 |
| Edition | 1.0 |
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 63287-1:2021 | Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification | 2021-08-25 | 표준 |
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IEC 60749-42:2014 - Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage 상세보기
IEC 60749-25:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling 상세보기
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