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분야 | TC 47 : Semiconductor devices |
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적용범위 | IEC 60749-6:2017 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure methods and time-to-failure of solid state electronic devices, including non-volatile memory devices (data-retention failure mechanisms). This test is considered non-destructive but should preferably be used for device qualification. If such devices are used for delivery, the effects of this highly accelerated stress test will need to be evaluated. Thermally activated failure mechanisms are modelled using the Arrhenius equation for acceleration, and guidance on the selection of test temperatures and durations can be found in IEC 60749-43. This edition includes the following significant technical changes with respect to the previous edition: a) additional test conditions; b) clarification of the applicability of test conditions. |
국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
페이지수 | 16 |
Edition | 2.0 |
No. | 표준번호 | 표준명 | 발행일 | 상태 |
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1 | IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | 2017-03-03 | 표준 |
2 | IEC 60749-6:2002/COR1:2003 | Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | 2003-08-12 | 구판 |
3 | IEC 60749-6:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | 2002-04-12 | 구판 |
IEC 60749-2:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure 상세보기
IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing 상세보기
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) 상세보기
IEC 60749-25:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling 상세보기
IEC 60068-2-27:2008 - Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock 상세보기
IEC 60068-2-6:2007 - Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) 상세보기
IEC 60664-4:2005 - Insulation coordination for equipment within low-voltage systems - Part 4: Consideration of high-frequency voltage stress 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
IEC TS 63134:2020 - Active assisted living (AAL) use cases 상세보기
IEC 60034-5:2020 RLV - Rotating electrical machines - Part 5: Degrees of protection provided by the integral design of rotating electrical machines (IP code) - Classification 상세보기
KS B ISO TS 25740-1 - 에스컬레이터 및 무빙워크에 대한 안전요건 — 제1부: 세계공통 필수 안전요건(GESRs) 상세보기
KS B ISO TS 8100-21 - 승객 및 화물 운송용 엘리베이터 —제21부: 세계공통 필수안전요건(GESRs)을 충족하는 세계공통 안전 파라미터(GSPs) 상세보기
KS C IEC TS 62872 - 산업 시설과 스마트 그리드 사이의 산업 공정 측정, 제어 및 자동화 시스템 인터페이스 상세보기