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Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
| 분야 | TC 47 : Semiconductor devices |
|---|---|
| 적용범위 | IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications. |
| 국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
| 페이지수 | 26 |
| Edition | 2.0 |
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 60749-30:2020 | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | 2020-08-17 | 표준 |
| 2 | IEC 60749-30:2020 RLV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | 2020-08-17 | 표준 |
| 3 | IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | 2011-08-10 | 구판 |
| 4 | IEC 60749-30:2005/AMD1:2011 | Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | 2011-05-25 | 구판 |
| 5 | IEC 60749-30:2005 | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | 2005-01-20 | 구판 |
IEC 60749-2:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure 상세보기
IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing 상세보기
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) 상세보기
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