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Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
| 분야 | TC 47 : Semiconductor devices |
|---|---|
| 적용범위 | Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy. |
| 국제분류(ICS)코드 | 31.080.01 : 반도체 장치 일반 |
| 페이지수 | 49 |
| Edition | 1.0 |
| No. | 표준번호 | 표준명 | 발행일 | 상태 |
|---|---|---|---|---|
| 1 | IEC 60749-20:2020 RLV | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat | 2020-08-31 | 표준 |
| 2 | IEC 60749-20:2020 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat | 2020-08-31 | 표준 |
| 3 | IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat | 2008-12-09 | 구판 |
| 4 | IEC 60749-20:2002/COR1:2003 | Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat | 2003-08-13 | 구판 |
| 5 | IEC 60749-20:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat | 2002-09-30 | 구판 |
IEC 60749-2:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure 상세보기
IEC 60749-11:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method 상세보기
IEC 60749-1:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General 상세보기
IEC 60749-8:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing 상세보기
IEC 60749-31:2002 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) 상세보기
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